FH Campus Wien University of Applied Sciences will be hosting the Austrian Packaging Day again this year. The Packaging Cockpit will be attending the event, and you can meet us at our stand.
The event will bring together representatives from across the packaging industry, including manufacturers, packers, service providers and authorities. The Austrian Packaging Day provides a unique opportunity to connect with key players in the packaging sector.
For further information please visit: www.fh-campuswien.ac.at